Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Platform Eligibility

Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® TSX-NI

Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. ¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Specification

Product
Product id	666044
Brand	Intel
Partnr	BX80684E2226G
EAN/UPC code	675901768177
Warranty (months)	36 months
Processor
Processor manufacturer	Intel
Processor family	Intel Xeon E
Processor model	E-2226G
Processor codename	Coffee Lake
Box	Y
Cooler included	Y
Component for	Server/Workstation
Processor socket	LGA 1151 (Socket H4)
Processor cores	6
Processor threads	6
Processor base frequency	3.4 GHz
Processor boost frequency	4.7 GHz
Thermal Design Power (TDP)	80 W
Processor lithography	14 nm
System bus rate	8 GT/s
Processor operating modes	64-bit
Processor cache	12 MB
Processor cache type	Smart Cache
Processor ARK ID	191038
Memory
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2666 MHz
Memory channels	Dual-channel
ECC	Y
Graphics
On-board graphics adapter	Y
Discrete graphics adapter	N
On-board graphics adapter model	Intel UHD Graphics P630
Maximum on-board graphics adapter memory	128 GB
On-board graphics adapter dynamic frequency (max)	1200 MHz
On-board graphics adapter base frequency	350 MHz
Number of displays supported (on-board graphics)	3
On-board graphics adapter 4K support	Y
On-board graphics adapter OpenGL version	4.5
On-board graphics adapter DirectX version	12.0
On-board graphics adapter maximum resolution (DisplayPort)	4096 x 2304 Pixels
On-board graphics adapter maximum resolution (HDMI)	4096 x 2160 Pixels
On-board graphics adapter maximum resolution (eDP - Integrated Flat Panel)	4096 x 2304 Pixels
On-board graphics adapter refresh rate at maximum resolution (HDMI)	24 Hz
On-board graphics adapter refresh rate at maximum resolution (eDP - Integrated Flat Panel)	60 Hz
On-board graphics adapter refresh rate at maximum resolution (DisplayPort)	60 Hz
On-board graphics adapter ID	0x3E96
Discrete graphics adapter model	Not available
Features
Execute Disable Bit	Y
Idle States	Y
Thermal Monitoring Technologies	Y
Maximum number of PCI Express lanes	16
PCI Express slots version	3.0
PCI Express configurations	1x16, 2x8, 1x8+2x4
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
PCI Express CEM revision	3.0
Scalability	1S
CPU configuration (max)	1
Embedded options available	N
Market segment	Server
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	G077159
Processor special features
Intel® AES New Instructions (Intel® AES-NI)	Y
Enhanced Intel SpeedStep Technology	Y
Intel Trusted Execution Technology	Y
Intel® Memory Protection Extensions (Intel® MPX)	Y
Intel® Clear Video HD Technology (Intel® CVT HD)	Y
Intel® Hyper Threading Technology (Intel® HT Technology)	N
Intel® Turbo Boost Technology	2.0
Intel® Quick Sync Video Technology	Y
Intel® InTru™ 3D Technology	Y
Intel® Turbo Boost Technology 2.0 frequency	4.7 GHz
Intel® Transactional Synchronization Extensions	Y
Intel® Optane™ Memory Ready	Y
Intel® Boot Guard	Y
Intel® vPro™ Platform Eligibility	Y
Intel® OS Guard	Y
Intel TSX-NI	Y
Intel® Secure Key	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel Clear Video Technology	Y
Intel Virtualization Technology (VT-x)	Y
Intel Virtualization Technology for Directed I/O (VT-d)	Y
Intel 64	Y
Intel Software Guard Extensions (Intel SGX)	Y
Operational conditions
Tcase	73 °C
Tjunction	100 °C
Packaging data
Package type	Retail box
Technical details
Supported memory types	DDR4-SDRAM
Maximum graphics adapter memory	128 GB
Product type	Processor
Processor ID	0x3E96
Bus speed	8 GT/s
Launch date	Q2'19
Maximum resolution & refresh rate (DisplayPort)	4096x2304@60Hz
Status	Launched
Maximum memory	128 GB
Weight & dimensions
Processor package size	37.5mm x 37.5mm mm
Other features
Maximum internal memory	128 GB