Intel Xeon W-1370. Processor family: Intel Xeon W, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics adapter model: Intel UHD Graphics P750, Maximum on-board graphics adapter memory: 64 GB, On-board graphics adapter base frequency: 350 MHz. Market segment: Workstation, PCI Express configurations: 1x16+1x4, 2x8+1x4, 1x8+3x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0, AVX-512. Intel® Turbo Boost Max Technology 3.0 frequency: 5.1 GHz, Intel® Turbo Boost Technology 2.0 frequency: 5 GHz

Specification

Product
Product id	757425
Brand	Intel
Partnr	BX80708W1370
EAN/UPC code	675901931441
Warranty (months)	36 months
Processor
Processor manufacturer	Intel
Processor family	Intel Xeon W
Processor model	W-1370
Box	N
Cooler included	N
Component for	Server/Workstation
Processor socket	LGA 1200 (Socket H5)
Processor cores	8
Processor threads	16
Processor base frequency	2.9 GHz
Processor boost frequency	5.1 GHz
Thermal Design Power (TDP)	80 W
Processor lithography	14 nm
System bus rate	8 GT/s
Processor operating modes	64-bit
Processor cache	16 MB
Processor cache type	Smart Cache
Memory bandwidth supported by processor (max)	50 GB/s
Memory
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM
Memory channels	Dual-channel
ECC	Y
Memory bandwidth (max)	50 GB/s
Graphics
On-board graphics adapter	Y
Discrete graphics adapter	N
On-board graphics adapter model	Intel UHD Graphics P750
Maximum on-board graphics adapter memory	64 GB
On-board graphics adapter dynamic frequency (max)	1300 MHz
On-board graphics adapter base frequency	350 MHz
On-board graphics adapter 4K support	Y
On-board graphics adapter OpenGL version	4.5
On-board graphics adapter maximum resolution (DisplayPort)	5120 x 3200 Pixels
On-board graphics adapter maximum resolution (HDMI)	4096 x 2160 Pixels
On-board graphics adapter maximum resolution (eDP - Integrated Flat Panel)	5120 x 3200 Pixels
On-board graphics adapter refresh rate at maximum resolution (HDMI)	60 Hz
On-board graphics adapter refresh rate at maximum resolution (eDP - Integrated Flat Panel)	60 Hz
On-board graphics adapter refresh rate at maximum resolution (DisplayPort)	60 Hz
Discrete graphics adapter model	Not available
Number of execution units	32
Features
Execute Disable Bit	Y
Idle States	Y
Thermal Monitoring Technologies	Y
Maximum number of PCI Express lanes	20
PCI Express slots version	4.0
PCI Express configurations	1x16+1x4, 2x8+1x4, 1x8+3x4
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0, AVX-512
Scalability	1S
CPU configuration (max)	1
Market segment	Workstation
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	5A992CN3
Commodity Classification Automated Tracking System (CCATS)	G167599
Processor special features
Intel® AES New Instructions (Intel® AES-NI)	Y
Enhanced Intel SpeedStep Technology	Y
Intel Trusted Execution Technology	Y
Intel® Clear Video HD Technology (Intel® CVT HD)	Y
Intel® Hyper Threading Technology (Intel® HT Technology)	Y
Intel® Turbo Boost Technology	2.0
Intel® Quick Sync Video Technology	Y
Intel® InTru™ 3D Technology	Y
Intel® Identity Protection Technology (Intel® IPT)	Y
Intel® Thermal Velocity Boost	N
Intel® Turbo Boost Max Technology 3.0 frequency	5.1 GHz
Intel® Turbo Boost Technology 2.0 frequency	5 GHz
Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0	Y
Intel® Optane™ Memory Ready	Y
Intel® Boot Guard	Y
Intel® Deep Learning Boost (Intel® DL Boost)	Y
Intel® vPro™ Platform Eligibility	Y
Intel Turbo Boost Max Technology 3.0	Y
Intel® OS Guard	Y
Intel® Secure Key	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel Clear Video Technology	Y
Intel Virtualization Technology (VT-x)	Y
Intel Virtualization Technology for Directed I/O (VT-d)	Y
Intel 64	Y
Intel Software Guard Extensions (Intel SGX)	N
Operational conditions
Tjunction	100 °C
Packaging data
Package type	Retail box
Technical details
Supported memory types	DDR4-SDRAM
Launch date	Q2'21
Status	Launched
Weight & dimensions
Processor package size	37.5 x 37.5 mm
Other features
Maximum internal memory	128 GB