Product |
Product id
| 889030
|
Brand
| Intel
|
Partnr
| CD8068904657302
|
EAN/UPC code
| 8592978319984
|
Warranty (months)
| 12 months
|
Processor |
Processor manufacturer
| Intel
|
Processor family
| Intel Xeon Gold
|
Processor series
| Intel Xeon Gold 5000 Series
|
Processor model
| 5317
|
Processor codename
| Ice Lake
|
Processor generation
| Intel Xeon Scalable 3rd Gen
|
Box
| N
|
Cooler included
| N
|
Component for
| Server/Workstation
|
Processor socket
| FCLGA4189
|
Processor cores
| 12
|
Processor threads
| 24
|
High priority cores
| 4
|
Low priority cores
| 8
|
Processor base frequency
| 3 GHz
|
Processor boost frequency
| 3.6 GHz
|
Low priority core frequency
| 2.8 GHz
|
Thermal Design Power (TDP)
| 150 W
|
Processor lithography
| 10 nm
|
System bus rate
| 11.2 GT/s
|
Processor operating modes
| 64-bit
|
Processor cache
| 18 MB
|
High priority core frequency
| 3.2 GHz
|
Processor ARK ID
| 215272
|
Memory |
Maximum internal memory supported by processor
| 6000 GB
|
Memory types supported by processor
| DDR4-SDRAM
|
Memory channels
| Octa-channel
|
ECC
| Y
|
Graphics |
On-board graphics adapter
| N
|
Discrete graphics adapter
| N
|
On-board graphics adapter model
| Not available
|
Discrete graphics adapter model
| Not available
|
Features |
Execute Disable Bit
| Y
|
Maximum number of PCI Express lanes
| 64
|
PCI Express slots version
| 4.0
|
Supported instruction sets
| SSE4.2, AVX, AVX 2.0, AVX-512
|
Scalability
| 2S
|
Embedded options available
| Y
|
Market segment
| Server
|
Harmonized System (HS) code
| 85423119
|
Export Control Classification Number (ECCN)
| 5A992CN3
|
Commodity Classification Automated Tracking System (CCATS)
| G178966
|
Processor special features |
Intel® AES New Instructions (Intel® AES-NI)
| Y
|
Intel Trusted Execution Technology
| Y
|
Intel® Speed Shift Technology
| Y
|
Intel® Hyper Threading Technology (Intel® HT Technology)
| Y
|
Intel® Turbo Boost Technology
| 2.0
|
Intel® Transactional Synchronization Extensions
| Y
|
Intel® Total Memory Encryption
| Y
|
Intel® Optane™ DC Persistent Memory Supported
| Y
|
AVX-512 Fused Multiply-Add (FMA) units
| 2
|
Intel® Crypto Acceleration
| Y
|
Intel® Platform Firmware Resilience Support
| Y
|
Maximum Enclave Size Support for Intel® SGX
| 64 GB
|
Intel® Deep Learning Boost (Intel® DL Boost)
| Y
|
Intel® Resource Director Technology (Intel® RDT)
| Y
|
Intel® Volume Management Device (VMD)
| Y
|
Intel® Run Sure Technology
| Y
|
Mode-based Execute Control (MBE)
| Y
|
Intel VT-x with Extended Page Tables (EPT)
| Y
|
Intel Virtualization Technology (VT-x)
| Y
|
Intel Virtualization Technology for Directed I/O (VT-d)
| Y
|
Intel 64
| Y
|
Intel Software Guard Extensions (Intel SGX)
| Y
|
Operational conditions |
Tcase
| 84 °C
|
Technical details |
Supported memory types
| DDR4-SDRAM
|
Target market
| Cloud Computing
|
Number of UPI links
| 3
|
Memory speed (max)
| 2933 MHz
|
Launch date
| Q2'21
|
Status
| Launched
|
Servicing status
| Baseline Servicing
|
Weight & dimensions |
Processor package size
| 77.5 x 56.5 mm
|
Other features |
Maximum internal memory
| 6000 GB
|