Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. ¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Identity Protection Technology

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Intel® Thermal Velocity Boost

Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.

Specification

Product
Product id	675938
Brand	Intel
Partnr	CM8070104282846
EAN/UPC code	8592978284015
Warranty (months)	12 months
Processor
Processor manufacturer	Intel
Processor family	Intel Core i9-10xxx
Processor model	i9-10900KF
Processor codename	Comet Lake
Box	N
Cooler included	N
Component for	PC
Processor socket	LGA 1200 (Socket H5)
Processor cores	10
Processor threads	20
Processor base frequency	3.7 GHz
Processor boost frequency	5.3 GHz
Thermal Design Power (TDP)	125 W
Configurable TDP-down frequency	3.3 GHz
Configurable TDP-down	95 W
Processor lithography	14 nm
System bus rate	8 GT/s
Processor operating modes	64-bit
Processor cache	20 MB
Processor cache type	Smart Cache
Memory bandwidth supported by processor (max)	45.8 GB/s
Processor ARK ID	199331
Generation	10th Generation
Memory
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory channels	Dual-channel
ECC	N
Graphics
On-board graphics adapter	N
Discrete graphics adapter	N
On-board graphics adapter model	Not available
Discrete graphics adapter model	Not available
Features
Execute Disable Bit	Y
Idle States	Y
Thermal Monitoring Technologies	Y
Maximum number of PCI Express lanes	16
PCI Express slots version	3.0
PCI Express configurations	1x16, 2x8, 1x8+2x4
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
PCI Express CEM revision	3.0
Thermal solution specification	PCG 2015D
Scalability	1S
CPU configuration (max)	1
Embedded options available	N
Market segment	Desktop
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	G077159
Processor special features
Intel® AES New Instructions (Intel® AES-NI)	Y
Enhanced Intel SpeedStep Technology	Y
Intel Trusted Execution Technology	N
Intel® Hyper Threading Technology (Intel® HT Technology)	Y
Intel® Turbo Boost Technology	2.0
Intel® Identity Protection Technology (Intel® IPT)	Y
Intel® Thermal Velocity Boost	Y
Intel® Turbo Boost Max Technology 3.0 frequency	5.2 GHz
Intel® Turbo Boost Technology 2.0 frequency	5.1 GHz
Intel® Transactional Synchronization Extensions	N
Intel® Thermal Velocity Boost Temperature	70 °C
Intel® Thermal Velocity Boost Frequency	5.3 GHz
Intel® Optane™ Memory Ready	Y
Intel® Boot Guard	Y
Intel® vPro™ Platform Eligibility	N
Intel Turbo Boost Max Technology 3.0	Y
Intel® OS Guard	Y
Intel Stable Image Platform Program (SIPP)	N
Intel® Secure Key	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel Virtualization Technology (VT-x)	Y
Intel Virtualization Technology for Directed I/O (VT-d)	Y
Intel 64	Y
Intel Software Guard Extensions (Intel SGX)	Y
Operational conditions
Tjunction	100 °C
Packaging data
Package width	44 mm
Package depth	116 mm
Package height	101 mm
Package type	Retail box
Technical details
Supported memory types	DDR4-SDRAM
Product type	Processor
Target market	Gaming, Content Creation
Bus speed	8 GT/s
Launch date	Q2'20
Status	Launched
Maximum memory	128 GB
Weight & dimensions
Processor package size	37.5 x 37.5 mm
Other features
Maximum internal memory	128 GB